CMOS输出晶体振荡器X1G004471000400适用于移动通讯设备
爱普生晶振SG5032CCN是一款CMOS输出晶体振荡器,小体积尺寸5.0x3.2mm四脚贴片晶振,有源晶振,电源电压4.5V至5.5V,频率范围2.5MHz至50MHz。具有超小型,轻薄型,低抖动,低功耗,高性能,高品质等特点,其中原厂编码X1G004471000400,频率20.000MHz,频率公差:±50ppm晶振,是爱普生常规有源晶振中的热销型号之一,可以在-40℃至+85℃的温度内稳定工作。SG5032CCN晶振被广泛用于移动通讯,汽车电子,医疗设备,智能家居,GPS定位器,安防设备,数码电子等。
CMOS输出晶体振荡器X1G004471000400适用于移动通讯设备
产品编码 | 型号 | 频率 | 贴片晶振 | 输出波 | 电源电压 | 工作温度 |
X1G004471000300 | SG5032CCN | 32.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471000400 | SG5032CCN | 20.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471000500 | SG5032CCN | 8.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471000600 | SG5032CCN | 16.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471000700 | SG5032CCN | 25.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471000800 | SG5032CCN | 40.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471000900 | SG5032CCN | 48.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471001000 | SG5032CCN | 7.372800MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471001100 | SG5032CCN | 10.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471001200 | SG5032CCN | 6.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471001300 | SG5032CCN | 10.700000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471001400 | SG5032CCN | 5.500000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471001500 | SG5032CCN | 18.432000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471001600 | SG5032CCN | 11.059200MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471001700 | SG5032CCN | 12.288000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471001800 | SG5032CCN | 14.745600MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471001900 | SG5032CCN | 18.432000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471002000 | SG5032CCN | 24.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471002100 | SG5032CCN | 24.576000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471002200 | SG5032CCN | 27.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471002300 | SG5032CCN | 29.491200MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471002400 | SG5032CCN | 3.276800MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471002500 | SG5032CCN | 3.579545MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471002600 | SG5032CCN | 3.686400MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471002700 | SG5032CCN | 4.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471002800 | SG5032CCN | 4.096000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471002900 | SG5032CCN | 4.915200MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471003100 | SG5032CCN | 33.330000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471003200 | SG5032CCN | 25.160000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471003300 | SG5032CCN | 4.608000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471003400 | SG5032CCN | 12.000000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471003500 | SG5032CCN | 16.700000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471003600 | SG5032CCN | 16.200000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471003700 | SG5032CCN | 6.050000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471003800 | SG5032CCN | 5.450000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471003900 | SG5032CCN | 5.550000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471004000 | SG5032CCN | 5.950000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471004100 | SG5032CCN | 11.289600MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471004200 | SG5032CCN | 2.500000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
X1G004471004300 | SG5032CCN | 7.175000MHz | 5.00x3.20x1.30mm | CMOS | 4.500 to 5.500 V | -40 to 85 °C |
CMOS输出晶体振荡器X1G004471000400适用于移动通讯设备
晶振特点和属性:
1. 按形状区分晶振有SMD(贴片晶振)和DIP(插件晶振)两种。贴片晶振价格跟插件晶振相对比下,贴片晶振价格贵些。
2. 按频率区分贴片晶振有MHZ和KHZ。MHZ常用封装的有SMD2016、SMD2520、SMD3225、SMD5032、SMD6035、SMD7050。而KHZ最常用的频率32.768KHZ;在手机和蓝牙应用的晶振频率有:12MHZ,16MHZ,24 MHZ,26 MHZ,32 MHZ贴片晶振配套使用。
3. 按性能区分贴片晶振分为:有源晶振(石英晶体振荡器、温补振荡器、压控振荡器、压控温补振荡器)和无源晶振(石英晶体谐振器、陶瓷晶振)。
4. 按材质区分贴片晶振分为金属封装和陶瓷封装。
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