CTS尽一切努力提供最优质的产品，以满足众多客户的需求。虽然CTS供应的产品看起来耐用，坚固和坚固，因为他们的刚性金属，陶瓷或塑料包装;内部的组件可能对各种条件很敏感。因此，关于我们产品的处理和安装，我们提出了以下建议。并非包罗万象，但确实为更有效地处理石英晶体和石英晶体振荡器提供了依据。

静电放电(ESD)灵敏度

石英晶体(条形和圆形结构)本身通常对ESD不敏感。在操作过程中，应采取适当的预防措施，避免静电产生，以免损坏其他电路。

石英振荡器是ESD敏感的。这些部件应使用所有适用的防静电处理预防措施进行处理，即静电防护工作站。CTS振荡器产品包装在适当的ESD包装中，以保护它们。

机械冲击

晶体所遭受的机械冲击会降低其电气参数，损坏环氧树脂安装结构或永久破坏晶体晶片本身。从桌面轻轻落下就能产生高达几千g的冲击。在适当的情况下，我们尽一切努力使我们的产品对机械冲击的敏感性降到最低。设备不应掉落在坚硬的表面上，如地板和桌面。最终用户应考虑实施规则和培训，使产品下降超过8英寸被认为是损坏的嫌疑，并保留处理。一般来说，CTS晶振建议处理掉的产品。

生产过程

在将振荡器插入印刷电路板时，应特别注意引脚的方向。如果安装不正确，可能会对本机造成电气损坏。

拾取和放置设备，测试夹具和其他工艺工具会对晶体和振荡器产品施加可能导致损坏的机械应力。适当的设备设置和过程监控是必要的，以尽量减少可能影响长期可靠性的过程的影响。

产品移除

当晶体和振荡器从应用板上取下时，会发生机械损伤

使用适当的去焊设备和技术。金属密封包装利用玻璃到金属密封周围的引脚是脆弱的。施加过多的热量和力量会使玻璃破裂，危及长期使用

可靠性和潜在的灾难性故障。当加热不均匀或在移除过程中使用过大的力时，陶瓷表面安装包容易开裂。

Every effort is made by CTS to supply the highest quality products that are able to satisfy a multitude of applications. All though the products that CTS supplies appear durable, strong and sturdy because of their rigid metal, ceramic or plastic package; the components inside may be sensitive to a variety of conditions. As a result,we have developed the following suggestions regarding the handling and installation of our products. This list is not all-inclusive, but does provide a basis for more effective handling of quartz crystal and crystal oscillator products.进口晶振

Electrostatic Discharge (ESD) Sensitivity

Quartz crystals (strip and round configurations) by themselves are typically not sensitive to ESD. Proper  precautions should betaken to avoid ESD during handling due to the potential damage to other circuitry.

Quartz oscillators are ESD sensitive. These components should be handled using all applicable ESD handling precautions, i.e. static safeguarded workstations. CTS oscillator products are packaged in appropriate ESD packaging for their protection.

Mechanical Shock

The amount of mechanical shock that a crystal is exposed to can degrade its electrical parameters, damage the epoxy mount structure or permanently destroy the crystal wafer itself. A short drop from a tabletop can result in shock levels as high as several thousand g’s. Every effort is made to minimize the susceptibility of our products to mechanical shock where appropriate. Units should not be dropped onto hard surfaces such as floors and

tabletops. End users should consider implementing rules and training such that product dropped more than eight inches be considered suspect for damage and held for disposition. Generally, we recommend disposal of dropped product.

Manufacturing Process

Care should betaken when inserting an oscillator into a printed circuit board by paying close attention to the pin orientation. Electrical damage can occur to the unit if it is installed incorrectly.

Pick and place equipment, test fixtures and other process tooling can place mechanical stresses on crystal and  oscillator product that may cause damage. Proper equipment set-up and in-process monitoring is necessary to minimize the effects of process that may affect long-term reliability.

Product Removal

Mechanical damage can occur when crystals and oscillators are being removed from application boards without

using proper de-soldering equipment and techniques. Metal hermetic packages utilize glass to metal seals around the pins that are fragile. Applying excessive heat and force will fracture the glass, jeopardizing the long-term

reliability and potentially cause a catastrophic failure. Ceramic surface mount packages are susceptible to cracking when uneven heating or excessive force is used during removal.